Structure and electric resistance of Sn–Cu(Ag) solders within pre-crystallization temperature region / Mudryi, S. I., Shtablavyi, I. I., Skliarchuk, V. M., Plevachuk, Yu. O., Korolyshyn, A. V., Yakymovych, A. S., Shevernoha, I. M., Sidorov, V. Ye. (2010)
Ukrainian

English  Materials Science (Physicochemical mechanics of materials)   /     Issue (2010, 46 (4))

Mudryi S. I., Shtablavyi I. I., Skliarchuk V. M., Plevachuk Yu. O., Korolyshyn A. V., Yakymovych A. S., Shevernoha I. M., Sidorov V. Ye.
Structure and electric resistance of Sn–Cu(Ag) solders within pre-crystallization temperature region


Cite:
Mudryi, S. I., Shtablavyi, I. I., Skliarchuk, V. M., Plevachuk, Yu. O., Korolyshyn, A. V., Yakymovych, A. S., Shevernoha, I. M., Sidorov, V. Ye. (2010). Structure and electric resistance of Sn–Cu(Ag) solders within pre-crystallization temperature region. Materials Science (Physicochemical mechanics of materials), 46 (4), 35-41. http://jnas.nbuv.gov.ua/article/UJRN-0000657310 [In Ukrainian].

 

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