Models of printed boards for solderless mounting of electronic components by foil perforation method / Efimenko, A. A., Paljukh, B. P. (2017)
Ukrainian

English  Technology and design in electronic equipment   /     Issue (2017, 4-5)

Efimenko A. A., Paljukh B. P.
Models of printed boards for solderless mounting of electronic components by foil perforation method


Cite:
Efimenko, A. A., Paljukh, B. P. (2017). Models of printed boards for solderless mounting of electronic components by foil perforation method. Technology and design in electronic equipment, 4-5, 3-9. http://jnas.nbuv.gov.ua/article/UJRN-0000798642 [In Russian].

 

Institute of Information Technologies of VNLU


+38 (044) 525-36-24
Ukraine, 03039, Kyiv, Holosiivskyi Ave, 3, room 209