Microstructure and thermal conductivity of silicon infiltrated SiC-material / Kulych, V. H., Fesenko, I. P., Kovtiukh, M. O., Tkach, V. M., Kaidash, O. M., Kuzmenko, Ye. F., Chasnyk, V. I., Ivzhenko, V. V. (2023)
Ukrainian

English  Superhard Materials   /     Issue (2023, 2)

Kulych V. H., Fesenko I. P., Kovtiukh M. O., Tkach V. M., Kaidash O. M., Kuzmenko Ye. F., Chasnyk V. I., Ivzhenko V. V.
Microstructure and thermal conductivity of silicon infiltrated SiC-material


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Cite:
Kulych, V. H., Fesenko, I. P., Kovtiukh, M. O., Tkach, V. M., Kaidash, O. M., Kuzmenko, Ye. F., Chasnyk, V. I., Ivzhenko, V. V. (2023). Microstructure and thermal conductivity of silicon infiltrated SiC-material. Superhard Materials, 2, 94-96. http://jnas.nbuv.gov.ua/article/UJRN-0001418746 [In Ukrainian].

 

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