Microstructure and thermal conductivity of silicon infiltrated SiC-material / Kulych, V. H., Fesenko, I. P., Kovtiukh, M. O., Tkach, V. M., Kaidash, O. M., Kuzmenko, Ye. F., Chasnyk, V. I., Ivzhenko, V. V. (2023)
Ukrainian

English  Superhard Materials   /     Issue (2023, 2)

Kulych V. H., Fesenko I. P., Kovtiukh M. O., Tkach V. M., Kaidash O. M., Kuzmenko Ye. F., Chasnyk V. I., Ivzhenko V. V.
Microstructure and thermal conductivity of silicon infiltrated SiC-material


Cite:
Kulych, V. H., Fesenko, I. P., Kovtiukh, M. O., Tkach, V. M., Kaidash, O. M., Kuzmenko, Ye. F., Chasnyk, V. I., Ivzhenko, V. V. (2023). Microstructure and thermal conductivity of silicon infiltrated SiC-material. Superhard Materials, 2, 94-96. http://jnas.nbuv.gov.ua/article/UJRN-0001418746 [In Ukrainian].

 

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