Effect of Co addition on interface reaction between Sn–Ag–Cu solder and Cu substrate / Wang J., Zhou Yu., Fan T. (2020)
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web address of the page http://jnas.nbuv.gov.ua/article/UJRN-0001534046
  The Paton welding journal   /     Issue (2020, Iss. 6)

Wang J., Zhou Yu., Fan T.
Effect of Co addition on interface reaction between Sn–Ag–Cu solder and Cu substrate

Бібліографічний опис:
Wang J., Zhou Yu., Fan T. Effect of Co addition on interface reaction between Sn–Ag–Cu solder and Cu substrate. The Paton welding journal. 2020. Iss. 6. С. 27-30. URL: http://jnas.nbuv.gov.ua/article/UJRN-0001534046

 

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