Development of deep silicon plasma etching for 3D integration technology / Golishnikov, A. A., Putrja, M. G. (2014)
Ukrainian

English  Technology and design in electronic equipment   /     Issue (2014, 1)

Golishnikov A. A., Putrja M. G.
Development of deep silicon plasma etching for 3D integration technology


Cite:
Golishnikov, A. A., Putrja, M. G. (2014). Development of deep silicon plasma etching for 3D integration technology. Technology and design in electronic equipment, 1, 36-41. http://jnas.nbuv.gov.ua/article/UJRN-0000405244 [In Russian].

 

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