Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing / Pashchenko, G. A., Kravetskyi, M. Yu., Fomin, A. V. (2015)
web address of the page http://jnas.nbuv.gov.ua/article/UJRN-0000714283
Semiconductor Physics, Quantum Electronics and Optoelectronics    А - 2019 /  Issue (2015, Vol. 18, № 3)
Pashchenko G. A., Kravetskyi M. Yu., Fomin A. V.
Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing
Cite:
Pashchenko, G. A., Kravetskyi, M. Yu., Fomin, A. V. (2015). Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing. Semiconductor Physics, Quantum Electronics and Optoelectronics , 18 (3), 330-333. http://jnas.nbuv.gov.ua/article/UJRN-0000714283 | |
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