Effect of co addition on interface reaction between Sn–Ag–Cu solder and Cu substrate / Jianxin Wang, Yun Zhou, Taikun Fan (2020)
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web address of the page http://jnas.nbuv.gov.ua/article/UJRN-0001132996
  Automatic Welding  Б - 2020  /     Issue (2020, № 6)

Jianxin Wang, Yun Zhou, Taikun Fan
Effect of co addition on interface reaction between Sn–Ag–Cu solder and Cu substrate

Cite:
Jianxin Wang, Yun Zhou, Taikun Fan (2020). Effect of co addition on interface reaction between Sn–Ag–Cu solder and Cu substrate. Automatic Welding, 6, 31-34. http://jnas.nbuv.gov.ua/article/UJRN-0001132996

 

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